(English) Nanostructured joining materials for the next generation of microelectronics

Din păcate acest articol este disponibil doar în Engleză Americană. For the sake of viewer convenience, the content is shown below in the alternative language. You may click the link to switch the active language. Electronic components are becoming smaller, more complex and more powerful – this calls for new solutions for joining them. An Citește mai mult despre(English) Nanostructured joining materials for the next generation of microelectronics[…]